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8610-60G, Heat Transfer Compound, Type 2, Non-Silicone 8615, Super Thermal Grease
Our Price: $9.95 In Stock
Our Price: $12.95 In Stock
Heat Transfer Compound, Type 2, Non-Silicone
Special synthetic base, fortified with metal oxides and compounded to a paste-like consistency for ease of application
High efficient thermal conductive properties
Means more rapid transfer of heat for longer component life
High temperature stability
Provides physical properties of low bleed and low evaporation for long-term service in any application that requires Heat Sink Compound.
Uses synthetic fluids and metal oxide fillers
Provides excellent conductive properties that exceed those of other heat sink formulas
Will not dry, harden, melt or migrate in any heat sink application
Compatible with metal and plastic components
Also available in a silicone version 		Super Thermal Grease. Designed for use with heat sinks to effectively dissipate heat generated by electronic devices and circuitry.  Ideally used to cool CPUs (over clocking), chipset and graphics cards.  
Formulated with Boron Nitride, this grease gives super high thermal conductivity without the capacitance issue associated with silver filled greases.
860-150G, Heat Transfer Compound, Type 1 - Silicone Shin-Etsu X-23-7783D, 55g Syringe
Our Price: $15.95 In Stock
Our Price: $238.80
Shin-Etsu X-23-7783D, 55G Syringe
Designed for use in transferring heat away from electrical and electronic devices such as; transistors, power diodes, semi-conductors, ballast's and thermocouple wells. High thermal conductivity, high dielectric constant, high dissipation factor, use with heat sinks or metal chassis, will not dry or harden. Contains zinc oxide and polydimethyl siloxane. Shin-Etsu Silicone Thermal Greases

These silicone fluid compounds contain thermally-conductive fillers. With their high thermal conductivity values, these products are ideal for use as the primary thermal interface material (TIM 1 and TIM 2) for CPUs, MPUs and GPUs. G765 has a high insulation resistance, while the other compounds were formulated to emphasize thermal conductivity. X23-7762 and X23-7783D product offerings were formulated emphasize high bulk thermal conductivity values and ease of workability.



Shin-Etsu MicroSi's thermal interface material is available in several cost effective packages which include syringes, cartridges and bulk containers.

Shin-Etsu MicroSi’s syringes are ideal for manual applications. Pre-filled syringes assure that a consistent shot weight is applied to the intended surface. Shin-Etsu MicroSi’s SQC processes provide a consistent dispense weight with each syringe. The Syringe Delivery Method provides the most flexibility for an organization, with the ability to utilize the same product package for production and field requirements without additional investment in application tools.
   
 
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