MinnTech Electronics

• Special synthetic base, fortified with metal oxides and compounded to a paste-like consistency for ease of application
• High efficient thermal conductive properties
  • Means more rapid transfer of heat for longer component life
• High temperature stability
  • Provides physical properties of low bleed and low evaporation for long-term service in any application that requires Heat Sink Compound.
• Uses synthetic fluids and metal oxide fillers
  • Provides excellent conductive properties that exceed those of other heat sink formulas
• Will not dry, harden, melt or migrate in any heat sink application
• Compatible with metal and plastic components

• Specifications
  
  

  Physical Properties Test Method Non Silicone 8610 Silicone  860 Appearance Visual Off white / smooth paste White paste Consistency ASTM D 217 310-320   Specific Gravity @ 25°C (77°F)   2.5 min 2.3 min Bleed % 24 hours @ 200°C FTM-321 1.0% max 2.0% max Evaporation 24 hours @ 200°C FTM-321 2.0% max 2.0% max Dropping Point ASTM D-566 > 500°F (260°C) > 500°F (260°C) Min. operating temp.   -40°F/-40°F 55°F/48°C Max. operating temp.   200°C 200°C (consistent)  300°C (intermittent) Electrical Properties Test Method Non Silicone 8610 Silicone  860 Thermal Conductivity Hot Wire Method Heat Flow #36 °C 0.773 W/m•K 0.657 W/m•K Dielectric Strength (0.05l gap) ASTM D-149 350 V/MIL 400 V/MIL Dielectric Constant @ 1000 Hz ASTM D- 150 4.4 3.81 Dissipation Factor @ 1000 Hz ASTM D 150 0.0021 0.0032 Resistivity @ 21°C ASTM D 150 6.38 x 1013Ohm•cm 1.5 x 1015 Ohm•cm

Benefits of Non Silicone Heat Transfer Compound OVER Silicone

No migration and component contamination.

Applications

• Typically, Heat Transfer Compounds (heat sink compounds) are used in OEM Electronic Component Plants to insure fast, accurate heat transfer in electronic components and circuitry
• Other used:
• Semiconductor Mounting Devices
• Thermal joints
• Ballast heat transfer mediums
• Power resistor mountings
• Thermocouple wells
• Transistor diodes & silicone rectifier base and mounting studs
• ALL electric and electronic devices where efficient heat transfer cooling through thermal coupling is required