MinnTech Electronics

NC-SMQ ® 92J is a halide-free, air reflow, no-clean solder paste formulated to leave a benign, probe-testable resi- due. The residue is easily penetrated and will not clog  multi-point probes. This product has other qualities such as consistent fine-pitch paste deposition, unsurpassed stencil life and tack time, and excellent wetting. NC-SMQ92J will perform well on high speed surface mount lines utilizing fast print speeds and rapid chip placement. NC-SMQ92J meets or surpasses all 

ANSI/ J-STD-004, -005 specifications and Bellcore test criteria. 

Alloys 

Indium Corporation manufactures low oxide spherical powder composed of Sn-Pb and Sn-Pb-Ag in the industry standard type 3 mesh size. Other, non-standard, mesh sizes are available upon request. The weight ratio of the flux/vehicle to the solder powder is referred to as the metal load and is typically in the range of 85-92% for standard alloy compositions. 

PASTEOT-83732

• Storage and Handling Procedures 

  Refrigerated storage will prolong the shelf life of solder paste. The shelf life of NC-SMQ92J is 6 months when stored at <10°C. Solder paste packaged in syringes and cartridges should be stored tip down. Solder paste should be allowed to reach ambient working temperature prior to use.  Generally, paste should be removed from refrigeration at least two hours before use. Actual time to reach thermal equilibrium will vary with container size. Paste temperature should be verified before use. Jars and cartridges should be labeled with date and time of opening. 

  
  

  
  

  Material Safety Data Sheets 

  The MSDS for this product can be found online at 

  http://www.indium.com/techlibrary/msds.php