MinnTech Electronics

Product Data Sheet

Features

• Shiny, smooth solder joints similar to Sn/Pb solder

• Low cost – does not contain Ag

• Lower dross formation than other SAC and Sn/

  Cu-based alloys

• Less copper erosion than SAC305

• Compatible with other Sn/Cu-based alloys – no

  need to dump your pot

• Available as a solder bar for wave soldering and

  cored wire for rework applications

  Why Cobalt?

  There are a number of Sn/Cu-doped alloys available in the industry today but, unlike cobalt (Co), they all have shortcomings.

  The addition of nickel (Ni) is popular, but Ni has
  a lower operating limit of 0.035%. Below that percentage, the benefits of Ni are lost. Co has a lower operating limit of 0.003% and a much lower risk of dopant depletion.

  Bismuth (Bi) is also commonly used as a dopant; however, numerous studies show that Bi content is related to fillet lifting. This is not a risk when using Co.

Physical Properties and Process Set-up

Low Dross

Because of Indium Corporation’s unique manufacturing process, Sn995 bar solder exhibits much lower dross than other Sn/Cu-based alloys.