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  8610-60G, Heat Transfer Compound, Type 2, Non-Silicone

 
Our Price: $9.95


Stock Status:In Stock
Product Code: 8610-60G
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Description Technical Specs
 
Heat Transfer Compound, Type 2, Non-Silicone. Special synthetic base, fortified with metal oxides and compounded to a paste-like consistency for ease of application
High efficient thermal conductive properties
Means more rapid transfer of heat for longer component life
High temperature stability
Provides physical properties of low bleed and low evaporation for long-term service in any application that requires Heat Sink Compound.
Features
  • Benefits of Non Silicone Heat Transfer Compound OVER Silicone
  • No migration and component contamination.
  • Applications
  • Typically, Heat Transfer Compounds (heat sink compounds) are used in OEM Electronic Component Plants to insure fast, accurate heat transfer in electronic components and circuitry
  • Other used:
  • Semiconductor Mounting Devices
  • Thermal joints
  • Ballast heat transfer mediums
  • Power resistor mountings
  • Thermocouple wells
  • Transistor diodes & silicone rectifier base and mounting studs
  • ALL electric and electronic devices where efficient heat transfer cooling through thermal coupling is required

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